This specification covers the detail requirements for ultra high density connectors, surface mounted on daughter board modules or fixed backplanes. The connector contacts are densely packed with .050 inch (1.27 mm) spacing between contact centers in the same row. These connectors are intended for use in assemblies requiring very densely packaged electronic components, and are commonly used in digital applications. Intended Use: These connectors are intended for use on printed wiring boards and backpanels on miniaturized equipment sub-assemblies with low power requirements. The connectors covered by this specification are militarily unique because they are required to operate satisfactorily under sinusoidal vibration (up to 17 g's tested over 50 to 2000 Hz); withstand 48 hours of salt spray; withstand 100 g's of shock with no electrical discontinuity; and operate at temperatures of minus 55 to plus 125 degrees Celsius. Commercial electronic components are not designed to withstand these extreme conditions or sudden environmental changes, and would experience catastrophic failure.

This specification covers the detail requirements for ultra high density connectors, surface mounted on daughter board modules or fixed backplanes. The connector contacts are densely packed with .050 inch (1.27 mm) spacing between contact centers in the same row. These connectors are intended for use in assemblies requiring very densely packaged electronic components, and are commonly used in digital applications. Intended Use: These connectors are intended for use on printed wiring boards and backpanels on miniaturized equipment sub-assemblies with low power requirements. The connectors covered by this specification are militarily unique because they are required to operate satisfactorily under sinusoidal vibration (up to 17 g's tested over 50 to 2000 Hz); withstand 48 hours of salt spray; withstand 100 g's of shock with no electrical discontinuity; and operate at temperatures of minus 55 to plus 125 degrees Celsius. Commercial electronic components are not designed to withstand these extreme conditions or sudden environmental changes, and would experience catastrophic failure.