This standard establishes a test method for determining if connectors or sockets can withstand exposure to soldering conditions either by soldering iron, solder dip, solder wave, or reflow soldering techniques.
Object
Soldering conditions may affect the electrical characteristics of the connector or socket and/or cause damage to component materials. They may also result in loosening of terminations, softening or distortion of insulation materials, opening of solder seals, weakening of mechanical joints, etc.

This standard establishes a test method for determining if connectors or sockets can withstand exposure to soldering conditions either by soldering iron, solder dip, solder wave, or reflow soldering techniques.
Object
Soldering conditions may affect the electrical characteristics of the connector or socket and/or cause damage to component materials. They may also result in loosening of terminations, softening or distortion of insulation materials, opening of solder seals, weakening of mechanical joints, etc.